MOJE Intelligence and South China University of Technology to carry out school-enterprise cooperation and exchange activities
On April 16, Professor Hu Yueming from the School of Automation Science and Engineering at South China University of Technology and Vice Dean Luo Jiaxiang and his team visited MOJE Smart for an inspection and guidance session. They were accompanied throughout the visit by Wu Zhida, Chairman and General Manager of MOJE Smart, Chief Engineer…
On April 16, Professor Hu Yueming from the School of Automation Science and Engineering at South China University of Technology and Vice Dean Luo Jiaxiang and his team visited MOJE Smart for an inspection and guidance session. They were accompanied throughout the visit by Wu Zhida, Chairman and General Manager of MOJE Smart, Chief Engineer Cheng Zhiguo, and Director of Comprehensive Management Hu Siyu.

During the visit, Professor Hu and Vice Dean Luo toured MOJE Smart’s production workshop, R&D center, and showroom, gaining detailed insights into the company’s technological development, product innovation, and market expansion efforts.

They expressed high recognition of MOJE Smart’s leading technology and high-quality products in the placement machine field and praised the company’s achievements in advancing intelligent equipment development.

Since 1998, Professor Hu has been closely involved in addressing major control and automation equipment challenges in the national economy. Under his leadership, his team has successfully developed several key foundational pieces of equipment for the electronics manufacturing industry in China, including the 8/4/2 placement head series of fully automated placement machines, fully automated insertion machines for LED components and parts, fully automated chip bonder machines for semiconductor packaging, and a series of fully automated intelligent peritoneal dialysis machines for kidney failure treatment. His work has earned him 15 invention and utility model patents and one software copyright registration. Additionally, the D-200 fully automated semiconductor chip bonder won the Third Prize for the Guangdong Science and Technology Progress Award in 2005, and the TP111 fully automated placement machine was named a National Key New Product in 2004.
